What does Reballing mean?
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What does Reballing mean?
Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using …
Do you use solder paste with BGA?
When using solder paste, it is recommended to use a lead-free paste along with lead-free BGAs. If that is not possible and leaded solder paste is used along with lead-free BGA’s then issues can occur. A leaded reflow profile will not melt the BGA solder spheres completely which can lead to weak solder joints.
How do I replace my BGA chips?
What are the steps of BGA repair?
- First, remove the components, such as the PCB.
- Next, remove the residual solder.
- Once you have removed all the excess solder, the BGA can be reballed.
- After the excess solder has been removed and the BGA has been reballed, the components and PCB can be re-soldered and reattached.
Can you reflow BGA?
Once you have removed all the excess solder, the BGA can be reballed. Reballing involves using a stencil to set new spheres of solder into the BGA. 4. After the excess solder has been removed and the BGA has been reballed, the components and PCB can be re-soldered and reattached.
Do I need solder paste for BGA?
Yes, you still want to use paste. The reason is, the balls remain firm, like balloons of solder, and may not stick to the surface; whereas the paste is finely divided, and wets and connects to surfaces very effectively. So the paste is able to wet both the pad and the ball, and stick them together.
What is BGA paste flux?
This No-Clean flux is engineered to be used in the placement and reflow of lead-free solders for BGA attach processes. Before reflow, the flux provides sufficient tack to hold the BGA in place. After reflow the residue is clear, colorless. This paste flux can also be used in the rework of components.
Do the BGA balls melt?
These solder spheres can be placed manually or by automated equipment, and are held in place with a tacky flux. The device is placed on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or by an infrared heater, melting the balls.
How many times can you rework a BGA?
There is no hard industry rule but the rule of thumb for most companies is no more than 5 to 6 thermal cycles at reflow.